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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BF721T1/D PNP Silicon Transistor COLLECTOR 2,4 BASE 1 EMITTER 3 BF721T1 Motorola Preferred Device PNP SILICON TRANSISTOR SURFACE MOUNT MAXIMUM RATINGS Rating Collector-Emitter Voltage Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Total Power Dissipation up to TA = 25C(1) Storage Temperature Range Junction Temperature Symbol VCEO VCBO VCER VEBO IC PD Tstg TJ Value - 300 -300 - 300 - 5.0 -100 1.5 - 65 to +150 150 Unit Vdc Vdc Vdc Vdc mAdc Watts C C 1 2 3 4 CASE 318E-04, STYLE 1 SOT-223 (TO-261AA) DEVICE MARKING DF THERMAL CHARACTERISTICS Characteristic Thermal Resistance from Junction to Ambient(1) Symbol RJA Max 83.3 Unit C/W ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) Collector-Base Breakdown Voltage (IC = -100 Adc, IE = 0) Collector-Emitter Breakdown Voltage (IC = -100 Adc, RBE = 2.7 k) Emitter-Base Breakdown Voltage (IE = -10 Adc, IC = 0) Collector-Base Cutoff Current (VCB = - 200 Vdc, IE = 0) Collector-Emitter Cutoff Current (VCE = - 250 Vdc, RBE = 2.7 k) (VCE = - 200 Vdc, RBE = 2.7 k, TJ = 150C) V(BR)CEO V(BR)CBO V(BR)CER V(BR)EBO ICBO ICER -- -- -50 -10 nAdc Adc - 300 -300 -300 - 5.0 -- -- -- -- -- -10 Vdc Vdc Vdc Vdc nAdc 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. REV 3 Motorola Small-Signal (c) Motorola, Inc. 1996 Transistors, FETs and Diodes Device Data 1 BF721T1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued) Characteristic Symbol Min Max Unit ON CHARACTERISTICS DC Current Gain (VCE = -25 mAdc, VCE = -20 Vdc) Collector-Emitter Saturation Voltage (IC = - 30 mAdc, IB = - 5.0 mAdc) hFE 50 -- -- VCE(sat) -- - 0.8 Vdc DYNAMIC CHARACTERISTICS Current-Gain -- Bandwidth Product (VCE = - 10 Vdc, IC = -10 mAdc, f = 35 MHz) Feedback Capacitance (VCE = - 30 Vdc, IC = 0, f = 1.0 MHz) fT Cre 60 -- -- 1.6 MHz pF 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data BF721T1 INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE POWER DISSIPATION The power dissipation of the SOT-223 is a function of the pad size. These can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows. PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 1.5 watts. PD = 150C - 25C 83.3C/W = 1.5 watts The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into The 83.3C/W for the SOT-223 package assumes the recommended collector pad area of 965 sq. mils on a glass epoxy printed circuit board to achieve a power dissipation of 1.5 watts. If space is at a premium, a more realistic approach is to use the device at a PD of 833 mW using the footprint shown. Using a board material such as Thermal Clad, a power dissipation of 1.6 watts can be achieved using the same footprint. MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds. MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.15 3.8 0.079 2.0 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.248 6.3 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 inches mm 0.091 2.3 SOT-223 Motorola Small-Signal Transistors, FETs and Diodes Device Data 3 BF721T1 PACKAGE DIMENSIONS A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 4 S 1 2 3 B D L G J C 0.08 (0003) H M K BASE COLLECTOR EMITTER COLLECTOR CASE 318E-04 ISSUE H TO-261AA Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data BF721T1/D *BF721T1/D* |
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